LSM303AGR Datasheet, PDF (66/68 Pages) STMicroelectronics – ultra-low-power 3D accelerometer and 3D magnetometer

Package information
9
Package information
LSM303AGR
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
9.1
LGA-12 package information
Figure 17. LGA-12 2x2x1 mm package outline and mechanical data
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DocID027765 Rev 5