LSM303AGR Datasheet, PDF (34/68 Pages) STMicroelectronics – ultra-low-power 3D accelerometer and 3D magnetometer

Application hints
5
Application hints
LSM303AGR
Figure 10. LSM303AGR electrical connections
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The device core is supplied through the Vdd line while the I/O pads are supplied through the
Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 μF aluminum) should
be placed as near as possible to pin 9 of the device (common design practice).
It is possible to remove Vdd, maintaining Vdd_IO, without blocking the communication bus,
in this condition the measurement chain is powered off.
The following recommendations apply to capacitor C1:
 It must be connected as close as possible to pins 5 and 6 since very high current
pulses flow from C1 to pin 5 and 6. This avoid problems caused by inductive effects
due to the length of the copper strips.
 It is highly recommended to use low ESR (max 200 mOhm)
The functionality of the device and the measured acceleration data are selectable and
accessible through the I²C or SPI interfaces. When using the I²C, CS must be tied high (i.e.
connected to Vdd_IO).
The functions, the threshold and the timing of the three interrupt pins (INT_1_XL, INT_2_XL,
and INT_MAG) can be completely programmed by the user through the I²C/SPI interface.
Soldering information
The LGA package is compliant with the ECOPACK^®, RoHS and “Green” standards.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com.
DocID027765 Rev 5