LAN9730 Datasheet, PDF (59/61 Pages) SMSC Corporation – High-Speed Inter-Chip (HSIC) USB 2.0

High-Speed Inter-Chip (HSIC) USB 2.0 to 10/100 Ethernet Controller
Datasheet
Chapter 7 Package Outline
7.1
56-Pin QFN Package
MIN
A
0.70
A1
0.00
A2
-
D/E
7.85
D1/E1
7.55
D2/E2
5.80
L
0.30
b
0.18
K
0.55
e
Figure 7.1 56-Pin QFN Package Definition
Table 7.1 56-Pin QFN Dimensions
NOMINAL
0.85
0.02
-
8.00
7.75
5.90
0.40
0.25
-
0.50 BSC
MAX
1.00
0.05
0.90
8.15
7.95
6.00
0.50
0.30
-
REMARKS
Overall Package Height
Standoff
Mold Cap Thickness
X/Y Body Size
X/Y Mold Cap Size
X/Y Exposed Pad Size
Terminal Length
Terminal Width
Center Pad to Pin Clearance
Terminal Pitch
SMSC LAN9730/LAN9730i
59
DATASHEET
Revision 1.1 (05-13-13)