LAN91C96I Datasheet, PDF (110/110 Pages) SMSC Corporation – NON-PCI SINGLE-CHIP FULL DUPLES ETHERNET CONTROLLER

Non-PCI Single-Chip Full Duplex Ethernet Controller
Figure 13.2 - 100 Pin TQFP Package Outline
Table 13.2 - 100 Pin TQFP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
~
~
1.20
Overall Package Height
A1
0.05
~
0.15
Standoff
A2
0.95
~
1.05
Body Thickness
D
15.80
~
16.20
X Span
D1
13.90
~
14.10
X body Size
E
15.80
~
16.20
Y Span
E1
13.90
~
14.10
Y body Size
H
0.09
~
0.20
Lead Frame Thickness
L
0.45
0.60
0.75
Lead Foot Length
L1
~
1.00
~
Lead Length
e
0.50 Basic
θ
0^o
~
7^o
W
0.17
0.22
0.27
Lead Pitch
Lead Foot Angle
Lead Width
R1
0.08
~
~
Lead Shoulder Radius
R2
0.08
~
0.20
Lead Foot Radius
ccc
~
~
0.08
Coplanarity
Notes:
1 _{Controlling Unit: millimeter.}
2 _{Tolerance on the true position of the leads is ± 0.04 mm maximum.}
3 _{Package body dimensions D1 and E1 do not include the mold protrusion.}
Maximum mold protrusion is 0.25 mm.
4 _{Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.}
5 _{Details of pin 1 identifier are optional but must be located within the zone indicated.}
Rev. 11/18/2004
Page 110
DATASHEET
SMSC DS – LAN91C96I