LAN91C96I Datasheet, PDF (109/110 Pages) SMSC Corporation – NON-PCI SINGLE-CHIP FULL DUPLES ETHERNET CONTROLLER

Non-PCI Single-Chip Full Duplex Ethernet Controller
Chapter 13 Package Outlines
Figure 13.1 - 100 Pin QFP Package Outline
Table 13.1 - 100 Pin QFP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
~
~
3.4
Overall Package Height
A1
0.05
~
0.5
Standoff
A2
2.55
~
3.05
Body Thickness
D
23.65
~
24.15
X Span
D1
19.90
~
20.10
X body Size
E
17.65
~
18.15
Y Span
E1
13.90
~
14.10
Y body Size
H
0.11
~
0.23
Lead Frame Thickness
L
0.73
0.88
1.03
Lead Foot Length
L1
~
1.95
~
Lead Length
e
0.65 Basic
θ
0^o
~
7^o
Lead Pitch
Lead Foot Angle
W
0.20
~
0.40
Lead Width
R1
0.10
~
0.25
Lead Shoulder Radius
R2
0.15
~
0.40
Lead Foot Radius
ccc
~
~
0.10
Coplanarity
Notes:
1 _{Controlling Unit: millimeter.}
2 _{Tolerance on the true position of the leads is ± 0.065 mm maximum}
3 _{Package body dimensions D1 and E1 do not include the mold protrusion.}
Maximum mold protrusion is 0.25 mm.
4 _{Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.}
5 _{Details of pin 1 identifier are optional but must be located within the zone indicated.}
SMSC DS – LAN91C96I
Page 109
DATASHEET
Rev. 11/18/2004