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| K4B2G1646C-HCF8000 Datasheet, PDF (6/64 Pages) Samsung semiconductor – 2Gb C-die DDR3 SDRAM Only x16 96FBGA with Lead-Free & Halogen-Free (RoHS compliant) | |||
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K4B2G1646C
datasheet
3. Package pinout/Mechanical Dimension & Addressing
3.1 x16 Package Pinout (Top view) : 96ball FBGA Package
Rev. 1.11
DDR3 SDRAM
1
2
3
456
7
8
9
A
VDDQ
DQU5
DQU7
B
VSSQ
VDD
VSS
C
VDDQ
DQU3
DQU1
D
VSSQ
VDDQ
DMU
E
VSS
VSSQ
DQL0
F
VDDQ
DQL2
DQSL
G
VSSQ
DQL6
DQSL
H
VREFDQ
VDDQ
DQL4
J
NC
VSS
RAS
K
ODT
VDD
CAS
L
NC
CS
WE
M
VSS
BA0
BA2
N
VDD
A3
A0
P
VSS
A5
A2
R
VDD
A7
A9
T
VSS
RESET
A13
DQU4
VDDQ
VSS
A
DQSU
DQU6
VSSQ
B
DQSU
DQU2
VDDQ
C
DQU0
VSSQ
VDD
D
DML
VSSQ
VDDQ
E
DQL1
DQL3
VSSQ
F
VDD
VSS
VSSQ
G
DQL7
DQL5
VDDQ
H
CK
VSS
NC
J
CK
VDD
CKE
K
A10/AP
ZQ
NC
L
NC
VREFCA
VSS
M
A12/BC
BA1
VDD
N
A1
A4
VSS
P
A11
A6
VDD
R
NC
A8
VSS
T
Ball Locations (x16)
Populated ball
Ball not populated
Top view
(See the balls through the package)
123456789
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
-6-
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