SE98 Datasheet, PDF (4/39 Pages) NXP Semiconductors – DDR memory module temp sensor, 3.3 V

NXP Semiconductors
SE98
DDR memory module temp sensor, 3.3 V
6. Pinning information
6.1 Pinning
terminal 1
index area
A0 1
A1 2
A2 3
V_SS 4
SE98PW
8 V_DD
7 EVENT
6 SCL
5 SDA
002aab806
Fig 2. Pin configuration for TSSOP8
A0 1
A1 2
A2 3
V_SS 4
SE98TK
8 V_DD
7 EVENT
6 SCL
5 SDA
002aab804
Transparent top view
Fig 3. Pin configuration for HVSON8
6.2 Pin description
Table 2. Pin description
Symbol
A0^[1]
A1
A2
V_SS
SDA
SCL
EVENT
V_DD
Pin Type
1
I
2
I
3
I
4
ground
5
I/O
6
I
7
O
8
power
Description
I²C-bus/SMBus slave address bit 0
I²C-bus/SMBus slave address bit 1
I²C-bus/SMBus slave address bit 2
device ground
SMBus/I²C-bus serial data input/output (open-drain).
Must have external pull-up resistor.
SMBus/I²C-bus serial clock input/output (open-drain).
Must have external pull-up resistor.
Thermal alarm output for high/low and critical temperature
limit (open-drain). Must have external pull-up resistor.
device power supply (3.0 V to 3.6 V)
[1] In general, application of 10 V on the A0 pin would not damage the pin, but NXP Semiconductors does not
guarantee the overvoltage for this pin.
SE98_4
Product data sheet
Rev. 04 — 2 February 2009
© NXP B.V. 2009. All rights reserved.
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