SE98 Datasheet, PDF (23/39 Pages) NXP Semiconductors – DDR memory module temp sensor, 3.3 V

NXP Semiconductors
SE98
DDR memory module temp sensor, 3.3 V
8.6 Temperature register (16-bit read-only)
Table 18. Temperature register bit allocation
Bit
15
14
13
12
11
Symbol ACT
AAW
BAW SIGN
Reset
0
0
0
0
0
Access
R
R
R
R
R
Bit
7
6
5
4
3
Symbol
TEMP[6:0]
Reset
0
0
0
0
0
Access
R
R
R
R
R
10
9
TEMP[10:7]
0
0
R
R
2
1
0
0
R
R
8
0
R
0
RFU
0
R
Table 19. Temperature register bit description
Bit
Symbol Description
15
ACT
Above Critical Trip.
0 — temperature is below the Critical Alarm Trip register setting
1 — temperature is equal to or above the Critical Alarm Trip register
setting
14
AAW
Above Alarm Window.
0 — temperature is equal to or below the Upper Boundary Alarm Trip
register
1 — temperature is above the Alarm window
13
BAW
Below Alarm Window.
0 — temperature is equal to or above the Lower Boundary Alarm Trip
register
1 — temperature is below the Alarm window
12
SIGN
Sign bit.
0 — positive temperature value
1 — negative temperature value
11:1
TEMP
Temperature Value (2’s complement). (LSB = 0.125 °C)
0
RFU
reserved; always 0
8.7 Manufacturer’s ID register (16-bit read-only)
The manufacture’s ID matches that assigned to NXP Semiconductors PCI-SIG (1131h),
and is intended for use to identify the manufacturer of the device.
Table 20. Manufacturer’s ID register bit allocation
Bit
15
14
13
12
11
10
9
8
Symbol
Manufacturer ID
Reset
0
0
0
1
0
0
0
1
Access
R
R
R
R
R
R
R
R
Bit
7
6
5
4
3
2
1
0
Symbol
(continued)
Reset
0
0
1
1
0
0
0
1
Access
R
R
R
R
R
R
R
R
SE98_4
Product data sheet
Rev. 04 — 2 February 2009
© NXP B.V. 2009. All rights reserved.
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