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SE98 Datasheet, PDF (35/39 Pages) NXP Semiconductors – DDR memory module temp sensor, 3.3 V | |||
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NXP Semiconductors
SE98
DDR memory module temp sensor, 3.3 V
15. Revision history
Table 31. Revision history
Document ID
Release date
Data sheet status
Change notice Supersedes
SE98_4
Modiï¬cations:
20090202
Product data sheet
-
SE98_3
⢠Changed data sheet descriptive title from âSO-DIMM SMBus/I2C-bus temperature sensorâ to
âDDR memory module temp sensor, 3.3 Vâ
⢠Section 1 âGeneral descriptionâ, ï¬rst sentence: changed from ââ20 °C to +125 °Câ to ââ40 °C to
+125 °Câ
⢠Section 2.2 âTemperature sensor featuresâ, last bullet item changed from ââ20 °C to +125 °Câ
to ââ40 °C to +125 °Câ
⢠Section 7.3 âEVENT output conditionâ re-written
⢠Added Section 7.10 âHot pluggingâ
⢠Table 7 âCapability register (address 00h) bit descriptionâ:
â description of symbol TRES: appended â(11-bit)â
â description of symbol BCAP: changed from âhas Alarm and Critical Trips capabilityâ to âhas
Alarm and Critical Trips interrupt capabilityâ
⢠Table 9 âConï¬guration register (address 01h) bit descriptionâ: description of bit 2, CVO, re-written
⢠Table 10 âHysteresis enableâ:
â added 2 right-most columns âCritical Alarm Window Bit (bit 15)â
â âTth(low)â replaced with âTtrip(l)â
â âTth(high)â replaced with âTtrip(u)â
â âhysteresisâ replaced with âThysâ
⢠Section 8.4 âTemperature formatâ: added 4th paragraph and Table 11
⢠Table 25 âCharacteristicsâ:
â changed descriptive line below table title from âTamb = â20 °C to +125 °Câ to âTamb = â40 °C to
+125 °Câ
SE98_3
â symbol Tlim(acc), condition âTamb = â20 °C to +125 °Câ changed to âTamb = â40 °C to +125 °Câ
⢠Table 26 âSMBus DC characteristicsâ: changed descriptive line below table title from
âTamb = â20 °C to +120 °Câ to âTamb = â40 °C to +120 °Câ
⢠Table 27 âSMBus AC characteristicsâ: changed descriptive line below table title from
âTamb = â20 °C to +120 °Câ to âTamb = â40 °C to +120 °Câ
20080404
Product data sheet
-
SE98_2
SE98_2
20080107
Product data sheet
-
SE98_1
SE98_1
20060510
Product data sheet
-
-
(9397 750 14649)
SE98_4
Product data sheet
Rev. 04 â 2 February 2009
© NXP B.V. 2009. All rights reserved.
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