SE98 Datasheet, PDF (30/39 Pages) NXP Semiconductors – DDR memory module temp sensor, 3.3 V

NXP Semiconductors
SE98
DDR memory module temp sensor, 3.3 V
12. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm
SOT530-1
D
c
y
Z
8
5
E
A
X
HE
vM A
pin 1 index
A2
A1
1
e
4
bp
wM
(A3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D⁽¹⁾ E⁽²⁾
e
HE
L
Lp
mm
1.1
0.15
0.05
0.95
0.85
0.25
0.30
0.19
0.20
0.13
3.1
2.9
4.5
4.3
0.65
6.5
6.3
0.94
0.7
0.5
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT530-1
MO-153
v
w
y
Z⁽¹⁾
θ
0.1
0.1
0.1
0.70
0.35
8°
0°
EUROPEAN
PROJECTION
ISSUE DATE
00-02-24
03-02-18
Fig 20. Package outline SOT530-1 (TSSOP8)
SE98_4
Product data sheet
Rev. 04 — 2 February 2009
© NXP B.V. 2009. All rights reserved.
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