SE98 Datasheet, PDF (2/39 Pages) NXP Semiconductors – DDR memory module temp sensor, 3.3 V

NXP Semiconductors
SE98
DDR memory module temp sensor, 3.3 V
2. Features
2.1 General features
I JEDEC (JC-42.4) SO-DIMM temperature sensor
I Optimized for voltage range: 3.0 V to 3.6 V
I Shutdown/Standby current: 8 µA (typ.) and 15 µA (max.)
I 2-wire interface: I²C-bus/SMBus compatible, 0 Hz to 400 kHz
I SMBus ALERT and TIMEOUT (programmable)
I Available packages: TSSOP8 and HVSON8
2.2 Temperature sensor features
I Temperature-to-Digital converter
I Operating current: 200 µA (typ.) and 250 µA (max.)
I Programmable hysteresis threshold: 0 °C, 1.5 °C, 3 °C, 6 °C
I Over/under/critical temperature EVENT output
I C grade accuracy:
N ±1 °C/±2 °C (typ./max.) → +75 °C to +95 °C
N ±2 °C/±3 °C (typ./max.) → +40 °C to +125 °C
N ±3 °C/±4 °C (typ./max.) → −40 °C to +125 °C
3. Applications
I DDR2 and DDR3 memory modules
I Laptops, personal computers and servers
I Enterprise networking
I Hard disk drives and other PC peripherals
4. Ordering information
Table 1. Ordering information
Type number Topside
mark
Package
Name
SE98PW
SE98
TSSOP8
SE98TK
SE98
HVSON8
Description
plastic thin shrink small outline package; 8 leads;
body width 4.4 mm
plastic thermal enhanced very thin small outline package;
no leads; 8 terminals; body 3 × 3 × 0.85 mm
Version
SOT530-1
SOT908-1
SE98_4
Product data sheet
Rev. 04 — 2 February 2009
© NXP B.V. 2009. All rights reserved.
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