SE98 Datasheet, PDF (34/39 Pages) NXP Semiconductors – DDR memory module temp sensor, 3.3 V

NXP Semiconductors
SE98
DDR memory module temp sensor, 3.3 V
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
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MSL: Moisture Sensitivity Level
Fig 22. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
14. Abbreviations
Table 30. Abbreviations
Acronym
Description
ADC
Analog-to-Digital Converter
ARA
Alert Response Address
CDM
Charged Device Model
CMOS
Complementary Metal-Oxide Semiconductor
DIMM
Dual In-line Memory Module
DRAM
Dynamic Random Access Memory
HBM
Human Body Model
I²C-bus
Inter Integrated Circuit bus
LSB
Least Significant Bit
MM
Machine Model
MSB
Most Significant Bit
SO-DIMM
Small Outline Dual In-line Memory Module
POR
Power-On Reset
SMBus
System Management Bus
SPD
Serial Presence Detect
SE98_4
Product data sheet
Rev. 04 — 2 February 2009
© NXP B.V. 2009. All rights reserved.
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