SE98 Datasheet, PDF (16/39 Pages) NXP Semiconductors – DDR memory module temp sensor, 3.3 V

NXP Semiconductors
SE98
DDR memory module temp sensor, 3.3 V
8.2 Capability register (00h, 16-bit read-only)
Table 6.
Bit
Symbol
Reset
Access
Bit
Symbol
Reset
Access
Capability register (address 00h) bit allocation
15
14
13
12
11
RFU[10:3]
0
0
0
0
0
R
R
R
R
R
7
6
5
4
3
RFU[2:0]
TRES[1:0]
0
0
0
1
0
R
R
R
R
R
10
0
R
2
WRNG
1
R
9
0
R
1
HACC
0
R
8
0
R
0
BCAP
1
R
Table 7.
Bit
15:5
4:3
2
1
0
Capability register (address 00h) bit description
Symbol
Description
RFU
Reserved for future use. Must be zero.
TRES
Temperature resolution.
10 — 0.125 °C LSB (11-bit)
WRNG
Wider range.
1 — can read temperatures below 0 °C and set sign bit accordingly
HACC
Higher accuracy (set during manufacture).
0 — C grade accuracy
BCAP
Basic capability.
1 — has Alarm and Critical Trips interrupt capability.
SE98_4
Product data sheet
Rev. 04 — 2 February 2009
© NXP B.V. 2009. All rights reserved.
16 of 39