SE98 Datasheet, PDF (37/39 Pages) NXP Semiconductors – DDR memory module temp sensor, 3.3 V

NXP Semiconductors
SE98
DDR memory module temp sensor, 3.3 V
18. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.1
General features . . . . . . . . . . . . . . . . . . . . . . . . 2
2.2
Temperature sensor features . . . . . . . . . . . . . . 2
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7
Functional description . . . . . . . . . . . . . . . . . . . 5
7.1
7.2
7.3
7.3.1
7.3.2
7.3.2.1
7.3.2.2
7.3.3
7.3.3.1
7.3.3.2
7.4
7.5
7.6
7.7
7.8
7.9
7.10
Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 5
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 5
EVENT output condition . . . . . . . . . . . . . . . . . . 6
EVENT pin output voltage levels and
resistor sizing . . . . . . . . . . . . . . . . . . . . . . . . . . 6
EVENT thresholds . . . . . . . . . . . . . . . . . . . . . . 8
Alarm window . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Critical trip. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Event operation modes . . . . . . . . . . . . . . . . . . . 9
Comparator mode. . . . . . . . . . . . . . . . . . . . . . . 9
Interrupt mode . . . . . . . . . . . . . . . . . . . . . . . . . 9
Conversion rate. . . . . . . . . . . . . . . . . . . . . . . . 10
Power-up default condition . . . . . . . . . . . . . . . 10
Device initialization . . . . . . . . . . . . . . . . . . . . . 10
SMBus time-out . . . . . . . . . . . . . . . . . . . . . . . 11
SMBus Alert . . . . . . . . . . . . . . . . . . . . . . . . . . 11
SMBus/I²C-bus interface . . . . . . . . . . . . . . . . 12
Hot plugging . . . . . . . . . . . . . . . . . . . . . . . . . . 14
8
Register descriptions . . . . . . . . . . . . . . . . . . . 15
8.1
8.2
8.3
8.4
8.5
8.5.1
8.5.2
8.5.3
8.6
8.7
8.8
8.9
Register overview . . . . . . . . . . . . . . . . . . . . . . 15
Capability register (00h, 16-bit read-only). . . . 16
Configuration register (01h, 16-bit read/write) 17
Temperature format . . . . . . . . . . . . . . . . . . . . 20
Temperature Trip Point registers . . . . . . . . . . . 21
Upper Boundary Alarm Trip register
(16-bit read/write) . . . . . . . . . . . . . . . . . . . . . . 21
Lower Boundary Alarm Trip register
(16-bit read/write) . . . . . . . . . . . . . . . . . . . . . . 22
Critical Alarm Trip register (16-bit read/write) . 22
Temperature register (16-bit read-only) . . . . . 23
Manufacturer’s ID register (16-bit read-only) . 23
Device ID register . . . . . . . . . . . . . . . . . . . . . . 24
SMBus register . . . . . . . . . . . . . . . . . . . . . . . . 24
9
Application design-in information . . . . . . . . . 25
9.1
SE98 in memory module application . . . . . . . 25
9.2
Layout consideration . . . . . . . . . . . . . . . . . . . 26
9.3
Thermal considerations . . . . . . . . . . . . . . . . . 26
10
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 26
11
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 27
12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 30
13
Soldering of SMD packages . . . . . . . . . . . . . . 32
13.1
Introduction to soldering. . . . . . . . . . . . . . . . . 32
13.2
Wave and reflow soldering . . . . . . . . . . . . . . . 32
13.3
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 32
13.4
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 33
14
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 34
15
Revision history . . . . . . . . . . . . . . . . . . . . . . . 35
16
Legal information . . . . . . . . . . . . . . . . . . . . . . 36
16.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 36
16.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
16.3
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 36
16.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 36
17
Contact information . . . . . . . . . . . . . . . . . . . . 36
18
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Date of release: 2 February 2009
Document identifier: SE98_4