PC87591E Datasheet, PDF (375/437 Pages) National Semiconductor (TI) – LPC Mobile Embedded Controllers

7.0 Device Specifications (Continued)
7.2.4 Input, TTL Compatible
Symbol: IN_T
Symbol
Parameter
Conditions
Min
Max
Unit
V_IH Input High Voltage
2.0
5.5¹
V
V_IL Input Low Voltage
−0.5¹
0.8
V
I_IL2 ^{Input Leakage Current}
0 < V_IN < V_CC
±1³
µA
1. Not tested; guaranteed by design.
2. Input leakage current includes the output leakage of the bidirectional buffers with TRI-STATE outputs.
3. Maximum 10 µA for all pins together.
7.2.5 Input, TTL Compatible with Schmitt Trigger
Symbol: IN_TS
Symbol
Parameter
Conditions
V_{IH Input High Voltage, 5V tolerant pins}¹
Input High Voltage, pins without 5V tolerance¹
V_IL Input Low Voltage
V_H Input Hysteresis
I_IL Input Leakage Current
0 < V_IN < V_SUP
1. See Section 7.1.2 on page 372.
2. Not tested; guaranteed by design.
3. V_SUP is V_DD or V_CC, according to the power well of the input.
4. Not tested; guaranteed by characterization.
5. Maximum 10 µA for all pins together.
Min
Max
2.0
5.5²
2.0 _VSUP3+0.5²
−0.5²
0.8
250⁴
±1⁵
Unit
V
V
V
mV
µA
7.2.6 Output, TTL Compatible Push-Pull Buffer
Symbol: O_p/n
Output, TTL-compatible, rail-to-rail push-pull buffer that is capable of sourcing p mA and sinking n mA
Symbol
Parameter
V_OH Output High Voltage
Conditions
I_OH = −p mA
I_OH = −50 µA
V_OL Output Low Voltage
I_OL = n mA
I_OL = 50 µA
1. V_SUP is V_DD or V_CC, according to the power well of the input.
Min
Max Unit
2.4
V
V_SUP1 −
V
0.2
0.4
V
0.2
V
Revision 1.07
375
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