MC92501 Datasheet, PDF (49/52 Pages) Motorola, Inc – ATM Cell Processor

17.3. 256-Lead GTBGA Outline
PACKAGE DIMENSIONS
GLOB-TOP BALL GRID ARRAY (GTBGA) PACKAGE
GC SUFFIX
CASE 1208-01
X
Y
D
DETAIL K
F
4X R2
M
EG
12.78
SQUARE
ZONE T
3 _{256X b}
0.30 Z X Y
0.10 Z
19X e
S
20
0.20
M
A ^A3
A1
4X R1
5
0.35 Z
A2
Z4
0.15 Z
DETAIL K
ROTATED 90 _CLOCKWISE
19X e
S
15
5
VIEW M±M
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
1
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
5. PARALLELISM REQUIREMENT APPLIES TO
ZONE T ONLY. PARALLELISM REQUIREMENT
SHALL EXCLUDE ANY EFFECT OF LASER MARK
ON TOP SURFACE OF PACKAGE.
DIM
A
A1
A2
A3
b
D
E
e
F
G
R1
R2
R1
MILLIMETERS
MIN MAX
---
2.83
0.50
0.70
0.56 REF
1.15
1.49
0.65
0.85
27.00 BSC
27.00 BSC
1.27 BSC
17.78
24.00
17.78
24.00
2.50 REF
0.40
2.50
0.635 BSC
MOTOROLA
MC92501
49