PIC18F25K20T-ISO Datasheet, PDF (441/456 Pages) Microchip Technology – 28/40/44-Pin Flash Microcontrollers with nanoWatt XLP Technology

APPENDIX A: REVISION HISTORY
Revision A (07/2006)
Original data sheet for PIC18F2XK20/4XK20 devices.
Revision B (03/2007)
Added part numbers PIC18F26K20 and
PIC18F46K20; Replaced Development Support
Section; Replaced Package Drawings.
Revision C (10/2007)
Revised Table 1, DIL Pins 34 and 35; Table 2, Pins 22
and 24; Table 1-2, Pins RB1 and RB3; Table 1-3, Pins
RB1 and RB3; Revised Sections 4.3, 4.4, 4.4.1, 4.4.2,
4.4.4; Revised Table 4-3, Note 2; Revised Table 6-1;
Revise Section 7.8: Revised Section 9.2; Revised
Examples 10-1 and 10-2; Revised Table 10-3, Pins
RB1 and RB3; Revised Sections 12.2 through 12.5;
Revised Register 16-1, bit 3-0; Revised Sections 16.1,
16.2, 16.4.4; Revised Register 16-2, bit 6-4; Revised
Table 16-2, Note 2; Revised Register 17-1, bit 6;
Revised Register 17-3; Revised Table 17-4; Revised
Register 19-1, added Note 2; Revised Register 20-3,
bits 5 and 4; Revised Register 23-4, bit 1; Revised Reg-
ister 23-12, bit 7-5; Revised Section 23.3; Revised Sec-
tion 24.1.1, instruction set descriptions; Revised
Section 26.0, voltage on MCLR; Revised DC Charac-
teristics 26.2, 26.3, 26.4 26.5, 26.6, 26.7, 26.8 and
26.10; Revised Tables 26-1, 26-6, 26-7, 26-9, 26-23.
Revision D (08/2008)
Update to Peripheral Highlights (USART module);
Deleted Section 2.2.6 (Oscillator Transitions); Revised
Sections 2.5.3, 2.9; Added Section 2.9.3 (Clock Switch
Timing); Deleted Section 2.10.4 (Clock Switching Tim-
ing); Replaced BAUDCTL with BAUDCON throughout;
Revised Table 5-2 (PLUSW0, PLUSW1, PLUSW2);
Add Note 1 to Table 7-1 (EEADRH); Revised Section
6.4.4 and Register 16-2 (FLT0 pin); Revised Registers
17-2 and 17-5 (SSPEN); Revised Register 17-6
(SEN); Added new paragraph after Figure 18-2;
Revised Note, Section 18.1.1; Deleted Note, Section
18.1.2; Added new Note 2, Sections 18.1.2.9 and
18.1.2.10; Revised Note 1, Section 18.3.1; Added
Section 18.3.2; Revised Section 18.3.5; Added new
Note 2, Sections 18.4.1.5, 18.4.1.10, 18.4.2.2,
18.4.2.4; Revised Register 21-1 (CVR); Revised Note
1, Registers 23-6, 23.8, 23-10, Table 23-3; Added new
Figure 26-1; Revised 26.2, 26.6, 26.7 (Note 3), 26.8,
26.9, 26.10; Revised Tables 26-1, 26-2, 26-3, 26-6, 26-
7, 26-8, 26-25; Updated Package Drawings.
PIC18F2XK20/4XK20
Revision E (04/2009)
Revised data sheet title; Revised Power-Managed
Modes, Peripheral Highlights, and Analog Features;
Revised 26.2, DC Char. table.
Revision F (09/2009)
Changed the values in the “Extreme Low-Power
Management with nanoWatt XLP” section; Added new
Note 2 to Pin Diagrams; Updated Electrical
Characteristics section; Added charts to the DS
Characteristics section; Removed Preliminary label;
Added UQFN to Pin Diagrams; Added the 28-pin
UQFN to Table 3-1; Updated MSSP section (Register
17-3; changing SSPADD<6:0> to SSPADD<7:0>);
Updated the Development Support section deleting
section 25.7; Added the 28-Lead UQFN package
marking diagrams and the 28-Lead Plastic Ultra Thin
Quad Flat, No Lead Package (MV) - 4X4X0.5 mm Body
(UQFN) package to Packaging Information section;
Other minor corrections.
Revision G (01/2010)
Updated Figure 9-1; Reviewed Section 26 (Electrical
Characteristics); Added Figures 27-29, 27-30, 27-31
and 27-32 to Section 27 (DC and AC Characteristics
Graphs and Tables); Reviewed Product Identification
System section.
 2010 Microchip Technology Inc.
DS41303G-page 441