70291E Datasheet, PDF (409/436 Pages) Microchip Technology – High-Performance, 16-bit Digital Signal Controllers

dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04
28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
NOTE 1
123
b
E
E1
e
h
α
h
φ
c
A
A2
L
A1
L1
β
Units
MILLMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
28
Pitch
e
1.27 BSC
Overall Height
A
–
–
2.65
Molded Package Thickness
A2
2.05
–
–
Standoff §
A1
0.10
–
0.30
Overall Width
E
10.30 BSC
Molded Package Width
E1
7.50 BSC
Overall Length
D
17.90 BSC
Chamfer (optional)
h
0.25
–
0.75
Foot Length
L
0.40
–
1.27
Footprint
L1
1.40 REF
Foot Angle Top
φ
0°
–
8°
Lead Thickness
c
0.18
–
0.33
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Mold Draft Angle Bottom
β
5°
–
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-052B
© 2011 Microchip Technology Inc.
DS70291E-page 409