 English |
|
|
|
|
|
|
|
| PIC16LF1847 Datasheet, PDF (407/408 Pages) Microchip Technology – 18/20/28-Pin Flash Microcontrollers with nanoWatt XLP Technology | |||
| |||
| ◁ |
PIC16(L)F1847
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X(1)
X
/XX
Device Tape and Reel Temperature Package
Option
Range
XXX
Pattern
Device:
Tape and
Option:
Temperature
Range:
PIC16F1847
PIC16LF1847
Reel blank = standard packaging (tube or tray)
T = Tape and Reel(1)
I
= -40ï°C to +85ï°C (Industrial)
E
= -40ï°C to +125ï°C (Extended)
Package:
ML = Micro Lead Frame (QFN) 6x6
MV = Micro Lead Frame (UQFN) 4x4
P = Plastic DIP
SO = SOIC
SS = SSOP
Pattern:
QTP, SQTP, Code or Special Requirements
(blank otherwise)
Examples:
a) PIC16F1847 - I/ML 301
Industrial temp.,
QFN package,
QTP pattern #301
b) PIC16F1847 - I/P
Industrial temp.,
PDIP package
c) PIC16F1847 - E/SS
Extended temp.,
SSOP package
d) PIC16LF1847T - E/SO
Tape and Reel,
Extended Temp.,
SOIC package
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identi-
fier is used for ordering purposes andis not
printed on the device package. Check with
your Microchip Sales Office for package
availability with the Tape and Reel option.
ï£ 2011 Microchip Technology Inc.
Preliminary
DS41453A-page 409
|
▷ |
German
Russian
Spanish
Italian
Polish
Chinese
Japanese
Korean
French
Portuguese