PIC16LF1847 Datasheet, PDF (358/408 Pages) Microchip Technology – 18/20/28-Pin Flash Microcontrollers with nanoWatt XLP Technology

PIC16(L)F1847
30.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +125°C
Param
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
JA Thermal Resistance Junction to Ambient 65.5
C/W 18-pin PDIP package
76.0
C/W 18-pin SOIC package
89.3
C/W 20-pin SSOP package
31.1
C/W 28-pin QFN package (6x6)
TBD
C/W 28-pin UQFN package (4x4)
TH02
JC Thermal Resistance Junction to Case
29.5
C/W 18-pin PDIP package
23.5
C/W 18-pin SOIC package
31.1
C/W 20-pin SSOP package
5.0
C/W 28-pin QFN package (6x6)
TBD
C/W 28-pin UQFN package (4x4)
TH03
TJMAX Maximum Junction Temperature
150
C
TH04
PD Power Dissipation
—
W
PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation
—
W
PINTERNAL = IDD x VDD⁽¹⁾
TH06
PI/O I/O Power Dissipation
—
W
PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))
TH07
PDER Derated Power
—
W
PDER = PDMAX (TJ - TA)/JA⁽²⁾
Legend: TBD = To Be Determined
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature.
3: TJ = Junction Temperature.
DS41453A-page 360
Preliminary
 2011 Microchip Technology Inc.