PIC16LF1508 Datasheet, PDF (340/384 Pages) Microchip Technology – 20-Pin Flash, 8-Bit Microcontrollers with nanoWatt XLP Technology

PIC16(L)F1508/9
29.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +125°C
Param
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
JA Thermal Resistance Junction to Ambient 62.2
C/W 20-pin PDIP package
75.0
C/W 20-pin SOIC package
89.3
C/W 20-pin SSOP package
43.0
C/W 20-pin QFN 4X4mm package
TH02
JC Thermal Resistance Junction to Case
27.5
C/W _{20-pin PDIP package}
23.1
C/W 20-pin SOIC package
31.1
C/W 20-pin SSOP package
5.3
C/W 20-pin QFN 4X4mm package
TH03
TJMAX Maximum Junction Temperature
150
C
TH04
TH05
PD Power Dissipation
PINTERNAL Internal Power Dissipation
—
W
PD = PINTERNAL + PI/O
—
W
PINTERNAL = IDD x VDD⁽¹⁾
TH06
TH07
PI/O
PDER
I/O Power Dissipation
Derated Power
—
W
PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))
—
W
PDER = PDMAX (TJ - TA)/JA⁽²⁾
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature
3: TJ = Junction Temperature
DS41609A-page 340
Preliminary
 2011 Microchip Technology Inc.