PIC24HJ16GP304-E Datasheet, PDF (264/274 Pages) Microchip Technology – High-Performance, 16-bit Microcontrollers

PIC24HJ32GP202/204 AND PIC24HJ16GP304
TABLE A-2: MAJOR SECTION UPDATES (CONTINUED)
Section Name
Section 22.0 “Electrical Characteristics”
Update Description
Added 28-pin SSOP Thermal Packaging Characteristics (see
Table 22-3).
Removed Note 4 from the DC Temperature and Voltage
Specifications (see Table 22-4).
Updated the maximum value for parameter DI19 and added
parameters DI28, DI29, DI60a, DI60b, and DI60c to the I/O Pin Input
Specifications (see Table 22-9).
Updated Note 3 in the PLL Clock Timing Specifications (see
Table 22-17).
Removed Note 2 from the AC Characteristics: Internal RC Accuracy
(see Table 22-18).
Updated the characteristic description for parameter DI35 in the I/O
Timing Requirements (see Table 22-20).
Updated all SPI specifications (see Table 22-28 through Table 22-35
and Figure 22-10 through Figure 22-16).
Added Note 4 to the 12-bit ADC Module Specifications (see
Table 22-39).
Section 23.0 “High Temperature Electrical
Characteristics”
Added Note 4 to the 10-bit ADC Module Specifications (see
Table 22-40).
Updated all ambient temperature end range values to +150ºC
throughout the chapter.
Updated the storage temperature end range to +160ºC.
Updated the maximum junction temperature from +145ºC to +155ºC.
Updated Note 1 in the PLL Clock Timing Specifications (see
Table 23-10).
Added Note 3 to the 12-bit Mode ADC Module Specifications (see
Table 23-17).
Section 24.0 “Packaging Information”
“Product Identification System”
Added Note 3 to the 10-bit Mode ADC Module Specifications (see
Table 23-18).
Added the 28-Lead SSOP package information (see Section 24.1
“Package Marking Information” and Section 24.2 “Package
Details”).
Added the “SS” definition for the SSOP package.
DS70289H-page 264
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