PIC24HJ16GP304-E Datasheet, PDF (192/274 Pages) Microchip Technology – High-Performance, 16-bit Microcontrollers

PIC24HJ32GP202/204 AND PIC24HJ16GP304
22.1 DC Characteristics
TABLE 22-1: OPERATING MIPS VS. VOLTAGE
Characteristic
VDD Range
(in Volts)
Temp Range
(in °C)
3.0-3.6V
3.0-3.6V
-40°C to +85°C
-40°C to +125°C
Max MIPS
PIC24HJ32GP202/204 and
PIC24HJ16GP304
40
40
TABLE 22-2: THERMAL OPERATING CONDITIONS
Rating
Industrial Temperature Devices
Operating Junction Temperature Range
Operating Ambient Temperature Range
Extended Temperature Devices
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD - Σ IOH)
I/O Pin Power Dissipation:
I/O = Σ ({VDD - VOH} x IOH) + Σ (VOL x IOL)
Maximum Allowed Power Dissipation
Symbol Min
Typ
Max Unit
TJ
-40
—
+125
°C
TA
-40
—
+85
°C
TJ
-40
—
+155
°C
TA
-40
—
+125
°C
PD
PINT + PI/O
W
PDMAX
(TJ - TA)/θJA
W
TABLE 22-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol Typ Max Unit Notes
Package Thermal Resistance, 44-pin QFN
θJA
32
—
°C/W
1
Package Thermal Resistance, 44-pin TFQP
θJA
45
—
°C/W
1
Package Thermal Resistance, 28-pin SPDIP
θJA
45
—
°C/W
1
Package Thermal Resistance, 28-pin SOIC
θJA
50
—
°C/W
1
Package Thermal Resistance, 28-pin SSOP
θJA
71
—
°C/W
1
Package Thermal Resistance, 28-pin QFN-S
θJA
35
—
°C/W
1
Note 1: Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.
DS70289H-page 192
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