PIC24HJ16GP304-E Datasheet, PDF (17/274 Pages) Microchip Technology – High-Performance, 16-bit Microcontrollers

PIC24HJ32GP202/204 AND PIC24HJ16GP304
2.0 GUIDELINES FOR GETTING
STARTED WITH 16-BIT
MICROCONTROLLERS
Note 1: This data sheet summarizes the features
of the PIC24HJ32GP202/204 and
PIC24HJ16GP304 family of devices. It is
not intended to be a comprehensive ref-
erence source. To complement the infor-
mation in this data sheet, refer to the
“dsPIC33F/PIC24H Family Reference
Manual”, which is available from the
Microchip website (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
2.1 Basic Connection Requirements
Getting started with the PIC24HJ32GP202/204 and
PIC24HJ16GP304 family of 16-bit microcontrollers
requires attention to a minimal set of device pin
connections before proceeding with development. The
following is a list of pin names, which must always be
connected:
• All VDD and VSS pins
(see Section 2.2 “Decoupling Capacitors”)
• All AVDD and AVSS pins (even if the ADC module is
not used)
(see Section 2.2 “Decoupling Capacitors”)
• VCAP
(see Section 2.3 “CPU Logic Filter Capacitor
Connection (VCAP)”)
• MCLR pin
(see Section 2.4 “Master Clear (MCLR) Pin”)
• PGECx/PGEDx pins used for In-Circuit Serial
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
• OSC1 and OSC2 pins when external oscillator
source is used
(see Section 2.6 “External Oscillator Pins”)
Additionally, the following pins may be required:
• VREF+/VREF- pins are used when external voltage
reference for the ADC module is implemented
Note:
The AVDD and AVSS pins must be
connected independent of the ADC
voltage reference source.
2.2 Decoupling Capacitors
The use of decoupling capacitors on every pair of
power supply pins, such as VDD, VSS, AVDD and
AVSS is required.
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have a resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
• Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the microcontroller. If space is con-
stricted, the capacitor can be placed on another
layer on the PCB using a via; however, ensure
that the trace length from the pin to the capacitor
is within one-quarter inch (6 mm) in length.
• Handling high frequency noise: If the board is
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
• Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the microcontroller pins. This ensures
that the decoupling capacitors are first in the
power chain. Equally important is to keep the
trace length between the capacitor and the power
pins to a minimum thereby reducing PCB track
inductance.
© 2007-2011 Microchip Technology Inc.
DS70289H-page 17