PIC24HJ256GP210A-I Datasheet, PDF (242/326 Pages) Microchip Technology – 16-bit Microcontrollers with Advanced Analog

PIC24HJXXXGPX06A/X08A/X10A
24.1 DC Characteristics
TABLE 24-1: OPERATING MIPS VS. VOLTAGE
Characteristic
VDD Range
(in Volts)
Temp Range
(in °C)
Max MIPS
PIC24HJXXXGPX06A/X08A/X10A
—
—
Note 1:
VBOR-3.6V⁽¹⁾
-40°C to +85°C
40
VBOR-3.6V⁽¹⁾
-40°C to +125°C
40
Device is functional at VBORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded
performance. Device functionality is tested but not characterized. Refer to parameter BO10 in Table 24-11
for the minimum and maximum BOR values.
TABLE 24-2: THERMAL OPERATING CONDITIONS
Rating
Industrial Temperature Devices
Operating Junction Temperature Range
Operating Ambient Temperature Range
Extended Temperature Devices
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD –  IOH)
I/O Pin Power Dissipation:
I/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation
Symbol Min
Typ
Max Unit
TJ
-40
—
+125
°C
TA
-40
—
+85
°C
TJ
-40
—
+150
°C
TA
-40
—
+125
°C
PD
PINT + PI/O
W
PDMAX
(TJ – TA)/JA
W
TABLE 24-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol Typ Max Unit Notes
Package Thermal Resistance, 100-pin TQFP (14x14x1 mm)
JA
40
—
°C/W
1
Package Thermal Resistance, 100-pin TQFP (12x12x1 mm)
JA
40
—
°C/W
1
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)
JA
40
—
°C/W
1
Package Thermal Resistance, 64-pin QFN (9x9x0.9 mm)
JA
28
—
°C/W
1
Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.
DS70592D-page 242
 2009-2012 Microchip Technology Inc.