PIC16LF720_11 Datasheet, PDF (194/244 Pages) Microchip Technology – 20-Pin Flash Microcontrollers with nanoWatt XLP Technology

PIC16(L)F720/721
23.5 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature-40°C  TA  +125°C
Param
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
JA Thermal Resistance Junction to
Ambient
62.4
C/W 20-pin PDIP package
85.2
C/W 20-pin SOIC package
108.1 C/W 20-pin SSOP package
40
C/W 20-pin QFN 4x4mm package
TH02
JC Thermal Resistance Junction to
Case
28.1
C/W 20-pin PDIP package
24.2
C/W 20-pin SOIC package
32.2
C/W 20-pin SSOP package
2.5
C/W 20-pin QFN 4x4mm package
TH03 TJMAX Maximum Junction Temperature
150
C
TH04
PD Power Dissipation
TH05 PINTERNAL Internal Power Dissipation
—
W PD = PINTERNAL + PI/O
—
W
PINTERNAL = IDD x VDD⁽¹⁾
TH06
TH07
PI/O I/O Power Dissipation
PDER Derated Power
—
W PI/O =  (IOL * VOL) +  (IOH * (VDD -
VOH))
—
W
PDER = PDMAX (TJ - TA)/JA⁽²⁾
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature
3: TJ = Junction Temperature
DS41430B-page 194
Preliminary
 2011 Microchip Technology Inc.