1055497-1 Datasheet, PDF (45/320 Pages) Tyco Electronics – RF Coax Products

RF Coax Connectors
BNC Connectors (50 ohm/75 ohm) Performance Specifications
Characteristics
Single
Crimp
(MIL Type)
Category B
O Crimp
(MIL Type)
Straight
Solder
Clamp
Electrical
Impedance, Nom.
(Ohms)
Working Voltage
(Volts RMS)
Contact Resistance
(Milliohms)
Initial Insulation Resistance
(Megohms)
Dielectric Withstanding
Voltage (VAC)
Corona Level at 70,000 ft.
(Volts, RMS)
RF Leakage, Max.
(dB)
RF Insertion Loss,
Max. (dB)
Frequency Range
(GHz)
VSWR in Frequency
Range Max.
Mechanical
Force to Engage (lbs. [N])/couple,
(in-lbs. [N-M]) max.
Coupling Nut Retention,
Min. N [lbs.]
Cable Retention,
N [lbs.]
Durability (Cycles)
Jam Nut Mounting Torque,
Max. [N•m] (in. lbs.)
Environmental
Temperature Range,
Operating (C°)
Vibration
Physical Shock
50
500
Inner: 1.5
Outer: 0.3
5000
1500
375
—
—
0-2.5
1.35
50
500
Inner: 1.5
Outer: 0.2
5000
1500
375
-55 at
2-3 GHz
0.2 at
3 GHz
0-4
1.30
13.3/11.12
[3/2.5]
444.8
[100]
266.9 [60]
(RG58C/U)
500
25
[2.8]
13.3/11.12
[3/2.5]
444.8
[100]
266.9 [60]
(RG58C/U)
500
25
[2.8]
-65 to +85
-65 to +165¹
-55 to +85²
MIL-STD-202 MIL-STD-202
Method 204 Method 204
Cond. B
Cond. B
MIL-STD-202 MIL-STD-202
Method 213 Method 213
Cond. G, 50 G’s Cond. G, 50 G’s
50
500
Inner: 1.5
Outer: .20
5000
1500
375
-55 at
2-3 GHz
0.2 at
3 GHz
0-4
1.30
13.3/.028
[3/2.5]
444.8
[100]
177.9 [40]
(RG58C/U)
500
25
[2.8]
-65 to +165
MIL-STD-202
Method 204
Cond. B
MIL-STD-202
Method 213
Cond. G
Thermal Shock
MIL-STD-202 MIL-STD-202 MIL-STD-202
Method 107 Method 107 Method 107
Moisture
Resistance
MIL-STD-202 MIL-STD-202
Method 106 Method 106
Salt Spray
Product
Specification
MIL-STD-202
Method 101
Cond. B
108-12002
MIL-STD-202
Method 101
Cond. B
108-12020
1_{Assembled to cable with polytetrafluorethylene dielectric.}
2_{Assembled to cable with polyethylene dielectric.}
3_{For Metal Threads}
4_{For Polyester Threads}
MIL-STD-202
Method 106
MIL-STD-202
Method 101
Cond. B
—
Right-Angle
Solder
Clamp
50
500
Inner: 1.5
Outer: .20
5000
1500
375
-55 at
2-3 GHz
0.3 at
3 GHz
0-4
1.35
13.3/.028
[3/2.5]
444.8
[100]
177.9 [40]
(RG58C/U)
500
—
-65 to +165
MIL-STD-202
Method 204
Cond. B
MIL-STD-202
Method 213
Cond. G
MIL-STD-202
Method 107
MIL-STD-202
Method 106
MIL-STD-202
Method 101
Cond. B
—
Commercial
O Crimp
& Hex Crimp
50 Ohms
50
500
Inner: 2.0
Outer: 1.0
5000
1500
375
-55 at
2-3 GHz
0.2 at
3 GHz
0-4
1.30
26.7/26.69
[6/6.0]
266.9
[60]
266.9 [60]
(RG58C/U)
500
25
[2.8]
-55 to +85
MIL-STD-1344
Method 2005
Cond. III
MIL-STD-1344
Method 2004
Cond. G, 100 G’s
MIL-STD-1344
Method 1003
Cond. A
MIL-STD-1344
Method 1002
Type II
MIL-STD-1344
Method 1001
Cond. B
108-12044
108-12047
Commercial
O Crimp
& Hex Crimp
75 Ohms
75
500
Inner: 2.0
Outer: 2.0
5000
1500
375
-55 at
1-2 GHz
0.15 at
2 GHz
0-2
1.30
26.7/26.69
[6/6.0]
266.9
[60]
266.9 [60]
(RG58C/U)
500
25
[2.8]
-55 to +85
MIL-STD-202
Method 204
Cond. B
MIL-STD-202
Method 213
Cond. I, 100 G’s
MIL-STD-202
Method 107
MIL-STD-202
Method 106
MIL-STD-202
Method 101
Cond. B
108-12095
Commercial PC Commercial
Board
Solder
50 & 75 Ohms 50 Ohm Jacks
50 & 75
500
Inner: 6/1.5
Outer: 3/0.2
5000
1500
—
—
—
0-4 and
0-2
—
50 & 75
500
Inner: 2.75
Outer: 1.0
5000
1500
375
—
—
0-4
—
—
—
—
—
266.9 [60]
(PCB Ret)
—
500
500
25³/12⁴
25
[2.8/1.4]
[2.8]
-55 to +85
-65 to +165
MIL-STD-202
Method 201A
MIL-STD-202
Method 213
Cond. I or A, 50 G’s
MIL-STD-202
Method 204
Cond. B
MIL-STD-202
Method 213
Cond. I, 100 G’s
MIL-STD-202
Method 107
MIL-STD-202
Method 107
MIL-STD-202
Method 106
MIL-STD-202
Method 101
Cond. B
108-12078
MIL-STD-202
Method 106
MIL-STD-202
Method 101
Cond. B
108-12079
Catalog 1307191
Revised 3-07
www.tycoelectronics.com
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
45
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208