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IS61QDB42M36 Datasheet, PDF (14/28 Pages) Integrated Silicon Solution, Inc – 72 Mb (2M x 36 & 4M x 18) QUAD (Burst of 4) Synchronous SRAMs
72 Mb (2M x 36 & 4M x 18)
QUAD (Burst of 4) Synchronous SRAMs
Capacitance (TA = 0 to + 70 C, VDD = 1.8V -5%, +5%, f = 1MHz)
Parameter
Symbol
Test Condition
Input capacitance
Data-in capacitance (D0–D35)
Data-out capacitance (Q0–Q35)
Clocks Capacitance (K, K, C, C)
CIN
CDIN
COUT
C CLK
VIN = 0V
VDIN = 0V
VOUT = 0V
VCLK = 0V
Maximum
4
4
4
4
Units
pF
pF
pF
pF
DC Electrical Characteristics (TA = 0 to + 70 C, VDD = 1.8V -5%, +5%)
Parameter
Symbol
Minimum Maximum
x36 average power supply operating current
(IOUT = 0, VIN = VIH or VIL)
IDD 33
IDD 40
IDD50
950
—
850
750
x18 average power supply operating current
(IOUT = 0, VIN = VIH or VIL)
IDD 33
IDD 40
IDD50
900
—
800
700
Power supply standby current
(R = VIH, W = VIH. All other inputs = VIH or VIH, IIH = 0)
Input leakage current, any input (except JTAG)
(VIN = VSS or VDD)
Output leakage current
(VOUT = VSS or VDDQ, Q in High-Z)
Output “high” level voltage (IOH = -6mA)
Output “low” level voltage (IOL = +6mA)
JTAG leakage current
(VIN = VSS or VDD)
1. IOUT = chip output current.
2. Minimum impedance output driver.
3. JEDEC Standard JESD8-6 Class 1 compatible.
4. For JTAG inputs only.
ISB
ILI
ILO
VOH
VOL
ILIJTAG
—
400
-2
+2
-2
VDDQ -.4
VSS
-100
+2
VDDQ
VSS+.4
+100
Units
mA
mA
mA
µA
µA
V
V
A
Notes
1
1
1
2, 3
2, 3
4
14
Integrated Silicon Solution, Inc.
Rev. B
11/10/09