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ISL78227 Datasheet, PDF (38/43 Pages) Intersil Corporation – 2-Phase Boost Controller with Integrated Drivers
ISL78227
the inductor’s saturation rating, OC1 peak current limiting (refer
to “Peak Current Cycle-by-Cycle Limiting (OC1)” on page 35) should
be selected below the inductor’s saturation current rating.
Output Capacitor
To filter the inductor current ripples and to have sufficient
transient response, output capacitors are required. A
combination of electrolytic and ceramic capacitors are normally
used.
The ceramic capacitors are used to filter the high frequency
spikes of the main switching devices. In layout, these output
ceramic capacitors must be placed as close as possible to the
main switching devices to maintain the smallest switching loop
in layout. To maintain capacitance over the biased voltage and
temperature range, good quality capacitors such as X7R or X5R
are recommended.
The electrolytic capacitors are normally used to handle the load
transient and output ripples. The boost output ripples are mainly
dominated by the load current and output capacitance volume.
For boost converter, the maximum output voltage ripple can be
estimated using Equation 30, where IOUTmax is the load current
at output, C is the total capacitance at output, and DMIN is the
minimum duty cycle at VINmax and VOUTmin.
VOUTripple= I--O-----U----T----m-C---a----x--2-------1-f--S--–--W---D----M-----I--N-----
(EQ. 30)
For 2-phase boost converter, the RMS current going through the
output current can be calculated by Equation 30 for D > 0.5,
where IL is per phase inductor DC current. For D < 0.5, time
domain simulation is recommended to get the accurate calculation
of the input capacitor RMS current.
ICoutRMS= IL  1 – D  2D – 1 
(EQ. 31)
It is recommended to use multiple capacitors in parallel to
handle this output RMS current.
Input Capacitor
Depending upon the system input power rail conditions, the
aluminum electrolytic type capacitor is normally used to provide
a stable input voltage. The input capacitor should be able to
handle the RMS current from the switching power devices. Refer
to Equation 5 and Figure 53 on page 27 to estimate the RMS
current the input capacitors need to handle.
Ceramic capacitors must be placed near the VIN and PGND pin of
the IC. Multiple ceramic capacitors including 1µF and 0.1µF are
recommended. Place these capacitors as close as possible to the IC.
Power MOSFET
The external MOSFETs driven by the ISL78227 controller need to
be carefully selected to optimize the design of the synchronous
boost regulator.
The MOSFET's BVDSS rating needs to have enough voltage
margin against the maximum boost output voltage plus the
phase node voltage transient spikes during switching.
As the UG and LG gate drivers are 5V output, the MOSFET VGS
need to be in this range.
The MOSFET should have low Total Gate Charge (Qg), low
ON-resistance (rDS(ON)) at VGS = 4.5V and small gate resistance
(Rg <1.5Ω is recommended). It is recommended that the
minimum VGS threshold is higher than 1.2V but not exceeding
2.5V, in order to prevent false turn-on by noise spikes due to high
dv/dt during phase node switching and maintain low rDS(ON)
under limitation of maximum gate drive voltage, which is 5.2V
(typical) for low-side MOSFET and 4.5V (typical) due to diode drop
of boot diode for high-side MOSFET.
Bootstrap Capacitor
The power required for high-side MOSFET drive is provided by the
boot capacitor connected between BOOT and PH pins. The
bootstrap capacitor can be chosen using Equation 32:
CBOOT  d----VQ-----Bg---O-a---t-O-e---T--
(EQ. 32)
Where Qgate is the total gate charge of the high-side MOSFET
and dVBOOT is the maximum droop voltage across the bootstrap
capacitor while turning on the high-side MOSFET.
Though the maximum charging voltage across the bootstrap
capacitor is PVCC minus the bootstrap diode drop (~4.5V), large
excursions below GND by PH node requires at least 10V rating for
this ceramic capacitor. To keep enough capacitance over the
biased voltage and temperature range, a good quality capacitor
such as X7R or X5R is recommended.
RESISTOR ON BOOTSTRAP CIRCUIT
In the actual application, sometimes a large ringing noise at the
PH node and the BOOT node are observed. This noise is caused
by high dv/dt phase node switching, parasitic PH node
capacitance due to PCB routing and the parasitic inductance. To
reduce this noise, a resistor can be added between the BOOT pin
and the bootstrap capacitor. A large resistor value will reduce the
ringing noise at PH node but limits the charging of the bootstrap
capacitor during the low-side MOSFET on-time, especially when
the controller is operating at very low duty cycle. Also large
resistance causes voltage dip at BOOT each time the high-side
driver turns on the high-side MOSFET. Make sure this voltage dip
will not trigger the high-side BOOT to PH UVLO threshold 3V (typical),
especially when a MOSFET with large Qg is used.
Loop Compensation Design
The ISL78227 uses constant frequency peak current mode
control architecture with a Gm amp as the error amplifier.
Figures 64 and 65 on page 39 show the conceptual schematics
and control block diagram, respectively.
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FN8808.2
February 24, 2016