80960CA-33 Datasheet, PDF (23/68 Pages) Intel Corporation – 80960CA-33, -25, -16 32-BIT HIGH-PERFORMANCE EMBEDDED PROCESSOR

80960CA-33, -25, -16
Table 11. 80960CA PGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
200
400
600
800
1000
(0) (1.01) (2.03) (3.07) (4.06) (5.07)
θ Junction-to-Case
(Case measured as 1.5 1.5 1.5
1.5
1.5
1.5
shown in Figure 5)
θ_JA
θ_JC
θ Case-to-Ambient
(No Heatsink)
17
14
11
9
7.1
6.6
θ Case-to-Ambient
(With Heatsink)*
13
9
5.5
5
3.9
3.4
NOTES:
1. This table applies to 80960CA PGA plugged into socket or soldered directly to board.
2. θ_JA = θ_JC + θ_CA
*0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
Table 12. 80960CA PQFP Package Thermal Characteristics
Thermal Resistance — °C/Watt
Airflow — ft./min (m/sec)
Parameter
0
50
100
200
400
(0) (0.25) (0.50) (1.01) (2.03)
θ Junction-to-Case (Case Measured
as shown in Figure 5)
5
5
5
5
5
θ Case-to-Ambient (No Heatsink)
19
18
17
15
12
NOTES:
1. This table applies to 80960CA PQFP soldered directly to board.
2. θ_JA = θ_JC + θ_CA
600
(3.04)
5
10
800
(4.06)
5
9
θ_JC
19