80960CA-33 Datasheet, PDF (22/68 Pages) Intel Corporation – 80960CA-33, -25, -16 32-BIT HIGH-PERFORMANCE EMBEDDED PROCESSOR

80960CA-33, -25, -16
3.4 Package Thermal Specifications
The 80960CA is specified
(case temperature) is within
for
the
raonpgeeraotifo0n^oCw–h1e0n0^oTCC.
T_C may be measured in any environment to deter-
mine whether the 80960CA is within specified oper-
ating range. Case temperature should be measured
at the center of the top surface, opposite the pins.
Refer to Figure 5.
T_A (ambient temperature) can be calculated from θ_CA
(thermal resistance from case to ambient) using the
following equation:
T_A = T_C – P*θ_CA
Table 10 shows the maximum T_A allowable (without
exceeding T_C) at various airflows and operating
frequencies (f_PCLK).
Note that T_A is greatly improved by attaching fins or a
heatsink to the package. P (maximum power
consumption) is calculated by using the typical I_CC
as tabulated in Section 4.4, DC Specifications and
V_CC of 5V.
Measure PGA temperature at
center of top surface
Measure PQFP case temperature
at center of top surface.
168 - Pin PGA
Pin 196
Pin 1
Figure 5. Measuring 80960CA PGA and PQFP Case Temperature
F_CX007A
Table 10. Maximum T_A at Various Airflows in ^oC (PGA Package Only)
Airflow-ft/min (m/sec)
f_PCLK
0
200
400
600
800
(MHz)
(0)
(1.01)
(2.03)
(3.04)
(4.06)
33
51
66
79
81
85
T_A with
Heatsink*
25
61
73
83
85
88
16
74
82
89
90
92
33
36
47
59
66
73
T_A without
Heatsink*
25
49
58
67
73
78
16
66
72
78
82
86
NOTES:
*0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
1000
(5.07)
87
89
93
75
80
87
18