TLE75008-EMD_15 Datasheet, PDF (61/64 Pages) Infineon Technologies AG – SPI Driver for Enhanced Relay Control

12
Package Outlines
TLE75008-EMD
Package Outlines
0.35 x 45"
2x
0.1 C D
3.9 !0.11)
0.25 !0.05 ²⁾
0.65 ^C
0.08 C
Seating Plane
0.2 M C A-B D 24x
0.64 _!0.25
D ^{6 !0.2}
0.2 M D
A
24
13
Bottom View
1
12
1
12
B
8.65 !0.1
Index Marking
0.1 C A-B 2x
24
13
6.4 !0.25
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion of 0.13 max.
Figure 33 PG-SSOP-24-9 Package drawing
PG-SSOP-24-4, -9-PO V01
6.4
0.45
0.65
Figure 34 TLE75008-EMD Package pads and stencil
PG-SSOP-24-4-FP V01
Data Sheet
61
Rev. 1.1, 2015-09-25