TLE75008-EMD_15 Datasheet, PDF (17/64 Pages) Infineon Technologies AG – SPI Driver for Enhanced Relay Control

TLE75008-EMD
4.3
Thermal Resistance
General Product Characteristics
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to www.jedec.org.
Table 4 Thermal Resistance
Parameter
Symbol
Values
Unit Note / Test Condition Number
Min. Typ. Max.
Junction to Soldering Point R_thJSP
–
5
7
K/W ¹⁾
P_4.3.1
measured to exposed
pad (pin 25)
Junction to Ambient
R_thJA
–
32
–
1) not subject to production test, specified by design
K/W ¹⁾²⁾
P_4.3.3
2) Specified R_thJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; the Product
(Chip+Package) was simulated on a 76.2 * 114.3 * 1.5 mm board with 2 inner copper layers (2 * 70 µm Cu, 2 * 35 µm Cu).
Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
4.3.1 PCB set up
1.5mm
Figure 4 2s2p PCB Cross Section
0.3mm
70µm
35µm
Zth_PCB_2s2p.emf
Data Sheet
17
Rev. 1.1, 2015-09-25