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HYB18L256160BF Datasheet, PDF (22/49 Pages) Infineon Technologies AG – DRAMs for Mobile Applications
HY[B/E]18L256160B[C/F]-7.5
256-Mbit Mobile-RAM
Functional Description
Table 10 Timing Parameters for READ
Parameter
Symbol
- 7.5
Units
min.
max.
Access time from CLK
CL = 3
tAC
–
CL = 2
tAC
–
DQ low-impedance time from CLK
tLZ
1.0
DQ high-impedance time from CLK
tHZ
3.0
Data out hold time
tOH
2.5
DQM to DQ High-Z delay (READ Commands)
tDQZ
–
ACTIVE to ACTIVE command period
tRC
67
ACTIVE to READ or WRITE delay
tRCD
19
ACTIVE to PRECHARGE command period
tRAS
45
PRECHARGE command period
tRP
19
5.4
ns
6.0
ns
–
ns
7.0
ns
–
ns
2
tCK
–
ns
–
ns
100k
ns
–
ns
1) These parameters account for the number of clock cycles and depend on the operating frequency as follows:
no. of clock cycles = specified delay / clock period; round up to next integer.
Notes
–
–
–
–
1)
1)
1)
1)
During READ bursts, the valid data-out element from the starting column address is available following the CAS
latency after the READ command. Each subsequent data-out element is valid nominally at the next positive clock
edge. Upon completion of a READ burst, assuming no other READ command has been initiated, the DQs go to
High-Z state.
Figure 13 and Figure 14 show single READ bursts for each supported CAS latency setting.
CLK
Command
Address
ACT
Ba A,
Row x
A10 (AP) Row x
DQ
tRCD
NOP
tRAS
tRC
READ
NOP
NOP
NOP
PRE
tRP
NOP
ACT
Ba A,
Col n
Dis AP
CL=2
Pre All
AP
Pre Bank A
Ba A,
Row b
Row b
DO n
DO n+1 DO n+2 DO n+3
Ba A, Col n = bank A, column n
AP = Auto Precharge
DO n = Data Out from column n
Dis AP = Disable Auto Precharge
Burst Length = 4 in the case shown.
3 subsequent elements of Data Out are provided in the programmed order following DO n.
Figure 13 Single READ Burst (CAS Latency = 2)
= Don't Care
Data Sheet
22
V1.4, 2004-04-30