TLE9260-3QX Datasheet, PDF (16/175 Pages) Infineon Technologies AG – Dedicated Data Sheets are available for the different product variants

TLE9260-3QX
4.3
Thermal Resistance
General Product Characteristics
Table 3 Thermal Resistance¹⁾
Parameter
Symbol
Min.
Values
Unit Note /
Number
Typ. Max.
Test Condition
Junction to Soldering Point R_thJSP
–
6
–
Junction to Ambient
R_thJA
–
33
–
1) Not subject to production test, specified by design.
K/W Exposed Pad
K/W ²⁾
P_4.3.1
P_4.3.2
2) According to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board for 1.5W. Board: 76.2x114.3x1.5mm³ with 2
inner copper layers (35µm thick), with thermal via array under the exposed pad contacting the first inner copper layer and
300mm2 cooling area on the bottom layer (70µm).
Data Sheet
16
Rev. 1.1, 2014-09-26