ICSSSTUB32871A Datasheet, PDF (17/18 Pages) Integrated Circuit Systems – 27-Bit Registered Buffer for DDR2

ICSSSTUB32871A
C
Seating
Plane
A1
b
T
REF
D
TOP VIEW
d TYP
D1
Numeric Designations
for Horizontal Grid
4 321
A
B
C
D
Alpha Designations
for Vertical Grid
(Letters I, O, Q & S
not used)
- e - TYP
E
h
c
TYP
REF
- e - TYP
0.12 C
E1
ALL DIMENSIONS IN MILLIMETERS
----- BALL GRID -----
Max.
D
E
T
e
HORIZ
VERT
TOTAL
d
Min/Max
Min/Max
13.50 Bsc 5.50 Bsc 1.20/1.40 0.80 Bsc
6
16
96
0.40/0.50
11.50 Bsc 5.00 Bsc 1.00/1.20 0.65 Bsc
6
16
96
0.35/0.45
Note: Ball grid total indicates maximum ball count for package. Lesser quantity may be used.
h
Min/Max
0.25/0.41
0.25/0.35
REF. DIMENSIONS
b
c
0.75
0.875
0.75
0.875
10-0055C
* Source Ref.: JEDEC Publication 95, MO-205
Ordering Information
ICSSSTUB32871Az(LF)T
Example:
ICS XXXX y z (LF) T
1186G—04/16/07
Designation for tape and reel packaging
Lead Free, RoHS Compliant (Optional)
Package Type
H = LFBGA (reduced size: 5.5 x 13.50)
HM = TFBGA (reduced size: 5.0 x 11.50)
Revision Designator (will not correlate with datasheet revision)
Device Type
Prefix
ICS = Standard Device
17