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HY29DL162 Datasheet, PDF (45/48 Pages) Hynix Semiconductor – 16 Megabit (2M x 8/1M x16) Low Voltage, Dual Bank, Simultaneous Read/Write Flash Memory
HY29DL162/HY29DL163
Latchup Characteristics
Description
Minimum
Maximum
Input voltage with respect to VSS on all pins except I/O pins
(including A[9], OE# and RESET#)
- 1.0
12.5
Input voltage with respect to VSS on all I/O pins
- 1.0
VCC Current
- 100
Notes:
1. Includes all pins except VCC. Test conditions: VCC = 1.8 V, one pin at a time.
TSOP Pin Capacitance
VCC + 1.0
100
Symbol
Parameter
Test Setup
Typ
Max
CIN Input Capacitance
COUT Output Capacitance
CIN2 Control Pin Capacitance
Notes:
1. Sampled, not 100% tested.
2. Test conditions: TA = 25 ºC, f = 1.0 MHz.
Data Retention
VIN = 0
VOUT = 0
VIN = 0
6
7.5
8.5
12
7.5
9
Parameter
Test Conditions
Minimum
Minimum Pattern Data Retention Time
150 ºC
10
125 ºC
20
PACKAGE DRAWINGS
Unit
V
V
mA
Unit
pF
pF
pF
Unit
Years
Years
Physical Dimensions
TSOP48 - 48-pin Thin Small Outline Package (measurements in millimeters)
Pin 1 ID
1
0.95
1.05
48
11.90
12.10
0.50 BSC
24
25
18.30
18.50
19.80
20.20
0.05
0.15
1.20
MAX
0.25MM (0.0098") BSC
0.08
0.20
0.10
0o
0.21
5o
0.50
0.70
r1.3/June 01
45