HMC700LP4 Datasheet, PDF (36/36 Pages) Hittite Microwave Corporation – 8 GHz 16-Bit Fractional-N PLL

v07.0411
HMC701LP6CE
8 GHz 16-Bit Fractional-N PLL
0
Table 44. Reg 22h Autotune Result Register
Bit
Type
Name
Default
Description
23:0
RO
Reserved
0
Reserved
Outline Drawing
NOTES:
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.
3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
6. PAD BURR LENGTH SHALL BE 0.15mm MAX.
PAD BURR HEIGHT SHALL BE 0.25mm MAX.
7. PACKAGE WARP SHALL NOT EXCEED 0.05mm
8. ALL GROUND LEADS AND GROUND PADDLE
MUST BE SOLDERED TO PCB RF GROUND.
9. REFER TO HITTITE APPLICATION NOTE
FOR SUGGESTED PCB LAND PATTERN.
Package Information
Part Number
Package Body Material
Lead Finish
HMC701LP6CE RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] 4-Digit lot number XXXX
[2] Max peak reflow temperature of 260 °C
MSL Rating
MSL1 ^[2]
Package Marking ^[1]
H701
XXXX
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
978-250-3343 tel • 978-250-3373 fax • Order On-line at www.hittite.com
Application Support: [e-mail]
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