HD66760 Datasheet, PDF (5/105 Pages) Hitachi Semiconductor – 104 X 80-dot Graphics LCD Controller/Driver for 256 Colors

HD66760 Pad Arrangement
HD66760
• Chip size: 14.4 mm × 3.1 mm
• Chip thickness: 550 µm (typ.)
• PAD coordinates: PAD center
• Coordinate origin: Chip center
• Au bump size (pin number is shown
in the blacket)
(1) 80 µm × 80 µm
dummy1 (500), dummy31 (121),
dummy32 (172) and dummy33 (449)
from C6 + (1) to dummy30 (112)
(2) 35 µm × 80 µm
from SEG294 (173) to SEG19 (448)
(3) 80 µm × 35 µm
from COM49 (122) to SEG295 (171)
from SEG18 (450) to COM9 (499)
(4) 45 µm × 80 µm
from COM8 (501) to COM1 (508)
from COM41 (113) to COM48 (120)
• Au bump pitch: Refer PAD coordinate
• Au bump height: 15 µm (typ.)
No.500
dummy1
COM8
COM1
C6+
C6-
C5+
C5-
C4+
C4-
C3+
C3-
C2+
C2-
C1+
C1-
GNDDUM1
VLOUT
VLOUT
VLOUT
VLPS
VLPS
VLPS
VL1REF
VLREF
V1REF
V1OUT
V2OUT
V3OUT
V4OUT
V5OUT
Vci
Vci
Vci
Vci
Vci
dummy2
dummy3
No.501
No.508
No.1
No.2
No.450
No.448
No.449
dummy33
SEG19
SEG20
dummy14
dummy15
Vcc
Vcc
Vcc
Vcc
Vcc
Vcc
GND
GND
GND
GND
GND
GND
GND
VTEST
VREG
VSW1
VSW2
GNDDUM2
TEST
OPOFF
VccDUM1
RESET*
CS*
RS
GNDDUM3
VccDUM2
IM0/ID
GNDDUM4
IM1
IM2
RW/RD*/SDA
E/WR*/SCL
GNDDUM5
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
DB8
DB9
DB10
DB11
DB12
DB13
DB14
DB15
OSC1
OSC2
dummy16
dummy17
HD66760
(Top view)
Y
X
dummy29
dummy30
COM41
COM48
dummy31
No.121
No.120
No.122
No.173
No.171
SEG293
SEG294
dummy32
No.172
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