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HD74AC Datasheet, PDF (49/52 Pages) Hitachi Semiconductor – HD74AC Series Common Information
Design Considerations
Since the static ICC requirements of CMOS devices are so low, output load currents must be prevented from
masking the current load of the device during an ICC test. Even a standard 500 Ω load resistor will sink 10
mA at 5 V, which is more than twice the ICC level being tested. Thus, most manufacturers will specify that
all outputs must be unloaded during ICC tests.
Another area of concern is identified when considering the inputs of the device. When the input is in the
transition region, ICC can be several orders of magnitude greater than the specification. When the input
voltage is in the transition region, both the n-channel and the p-channel transistors in the input totem-pole
structure will be slightly on, and a conduction is created from VCC to ground. This conduction path leads to
the increased ICC current seen in the ICC vs. VIN curve (figure 22). When the input is at either rail, the input
structure no longer conducts. Most ICC testing is done with all of the inputs tied to either VCC or ground. If
the inputs are allowed to float, they will typically float to the middle of the transition region, and the input
structure will conduct an order of magnitude more current than the actual ICC of the device under test which
is being measured by the tester.
When testing the ICC of a CMOS HD74AC245/HD74ACT245, problems can arise depending upon how the
test is conducted. Note the structure of the HD74AC245/HD74ACT245’s I/O pins illustrated figure 23.
10.00
0.00
0.00
VIN(V)
5.00
Figure 22 ICC versus IIN
Drive Enable
I/O PAD
I/O PAD
Figure 23 HD74AC245/HD74ACT245 I/O Structure
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