MC9S12DT256_06 Datasheet, PDF (95/132 Pages) Freescale Semiconductor, Inc – Device User Guide V03.07

MC9S12DT256 Device User Guide — V03.07
Table A-5 Thermal Package Characteristics¹
Num C
Rating
Symbol Min
Typ
1 T _{Thermal Resistance LQFP112, single sided PCB}²
θ_JA
-
-
Thermal Resistance LQFP112, double sided PCB
2 T _{with 2 internal planes3}
θ_JA
-
-
3 T Thermal Resistance LQFP 80, single sided PCB
θ_JA
-
-
4
T
Thermal Resistance LQFP 80, double sided PCB
with 2 internal planes
θ_JA
-
-
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-2
3. PC Board according to EIA/JEDEC Standard 51-7
Max
54
41
51
41
Unit
o_C/W
o_C/W
o_C/W
o_C/W
A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.
not all pins feature pull up/down resistances.
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