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XPC8260ZUIFBC Datasheet, PDF (8/50 Pages) Freescale Semiconductor, Inc – PowerQUICC II Integrated Communications Processor Hardware Specifications | |||
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Electrical and Thermal Characteristics
Table 2 lists recommended operational voltage conditions.
Table 2. Recommended Operating Conditions1
Rating
Symbol
Value
Unit
Core supply voltage
PLL supply voltage
VDD
1.7 â 1.92
1.7â2.13
1.9 â2.24
V
VCCSYN
1.7 â 1.92
1.7â2.13
1.9â2.24
V
I/O supply voltage
VDDH
3.135 â 3.465
V
Input voltage
VIN
GND (â0.3) â 3.465
V
Junction temperature (maximum)
Tj
1055
°C
Ambient temperature
TA
0â705
°C
1 Caution: These are the recommended and tested operating conditions. Proper device operating outside of these
conditions is not guaranteed.
2 CPU frequency less than or equal to 200 MHz.
3 CPU frequency greater than 200 MHz but less than 233 MHz.
4 CPU frequency greater than or equal to 233 MHz.
5 Note that for extended temperature parts the range is (-40)TAâ 105Tj.
NOTE: Core, PLL, and I/O Supply Voltages
VDDH, VCCSYN, and VDD must track each other and both must vary in
the same directionâin the positive direction (+5% and +0.1 Vdc) or in the
negative direction (â5% and â0.1 Vdc).
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (either GND or VCC).
Figure 2 shows the undershoot and overshoot voltage of the 60x and local bus memory interface of the
MPC8280. Note that in PCI mode the I/O interface is different.
4V
GVDD + 5%
VIH
GVDD
GND
VIL GND â 0.3 V
GND â 1.0 V
Not to exceed 10%
of tSDRAM_CLK
Figure 2. Overshoot/Undershoot Voltage
MPC8260A PowerQUICC⢠II Integrated Communications Processor Hardware Specifications, Rev. 2.0
8
Freescale Semiconductor
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