XPC8260ZUIFBC Datasheet, PDF (34/50 Pages) Freescale Semiconductor, Inc – PowerQUICC II Integrated Communications Processor Hardware Specifications

Pinout
Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view.
Copper Heat Spreader
(Oxidized for Insulation)
Polymide Tape
View
Die
Attach
Pressure Sensitive
Etched
Adhesive
Cavity
Soldermask
Die
Glob-Top Filled Area
1.27 mm Pitch
Glob-Top Dam
Copper Traces
Wire Bonds
Figure 14. Side View of the TBGA Package
Table 21 shows the pinout list of the MPC826xA. Table 20 defines conventions and acronyms used in
Table 21.
Symbols used in Table 21 are described in Table 20.
Table 20. Symbol Legend
OVERBAR
UTM
UTS
UT8
UT16
MII
Symbol
Meaning
Signals with overbars, such as TA, are active low.
Indicates that a signal is part of the UTOPIA master interface.
Indicates that a signal is part of the UTOPIA slave interface.
Indicates that a signal is part of the 8-bit UTOPIA interface.
Indicates that a signal is part of the 16-bit UTOPIA interface.
Indicates that a signal is part of the media independent interface.
BR
BG
ABB/IRQ2
TS
A0
A1
A2
A3
A4
A5
A6
A7
Table 21. Pinout List
Pin Name
Ball
W5
F4
E2
E3
G1
H5
H2
H1
J5
J4
J3
J2
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
34
Freescale Semiconductor