XPC8260ZUIFBC Datasheet, PDF (47/50 Pages) Freescale Semiconductor, Inc – PowerQUICC II Integrated Communications Processor Hardware Specifications

Package Description
5.2 Mechanical Dimensions
Figure 15 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA
package.
Notes:
1. Dimensions and Tolerancing per
ASME Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is measured at the
maximum solder ball diameter, parallel
to primary data A.
Millimeters
Dim
Min Max
A 1.45 1.65
A1 0.60 0.70
A2 0.85 0.95
A3 0.25 —
b 0.65 0.85
D 37.50 BSC
D1 35.56 REF
e 1.27 BSC
E 37.50 BSC
E1 35.56 REF
Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
Freescale Semiconductor
47