XPC8260ZUIFBC Datasheet, PDF (46/50 Pages) Freescale Semiconductor, Inc – PowerQUICC II Integrated Communications Processor Hardware Specifications

Package Description
3 _{On PCI devices (MPC8265 and MPC8266) this pin should be used as CLKIN2. On non-PCI devices (MPC8260A and}
MPC8264) this is a spare pin that must be pulled down or left floating.
4 _{Must be pulled down or left floating.}
5 _{On PCI devices (MPC8265 and MPC8266) this pin should be asserted if the PCI function is desired or pulled up or}
left floating if PCI is not desired. On non-PCI devices (MPC8260A and MPC8264) this is a spare pin that must be pulled
up or left floating.
6 _{For information on how to use this pin, refer to MPC8260 PowerQUICC II Thermal Resistor Guide available at}
www.freescale.com.
5 Package Description
The following sections provide the package parameters and mechanical dimensions for the MPC826xA.
5.1 Package Parameters
Package parameters are provided in Table 22. The package type is a 37.5 × 37.5 mm, 480-lead TBGA.
Table 22. Package Parameters
Parameter
Value
Package Outline
37.5 × 37.5 mm
Interconnects
480 (29 × 29 ball array)
Pitch
1.27 mm
Nominal unmounted package height 1.55 mm
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
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Freescale Semiconductor