XPC8260ZUIFBC Datasheet, PDF (7/50 Pages) Freescale Semiconductor, Inc – PowerQUICC II Integrated Communications Processor Hardware Specifications

Electrical and Thermal Characteristics
— Hot-Swap friendly (supports the Hot Swap Specification as defined by PICMG 2.1 R1.0
August 3, 1998)
— Support for 66 MHz, 3.3 V specification
— 60x-PCI bus core logic which uses a buffer pool to allocate buffers for each port
— Makes use of the local bus signals, so there is no need for additional pins
2 Electrical and Thermal Characteristics
This section provides AC and DC electrical specifications and thermal characteristics for the MPC826xA.
2.1 DC Electrical Characteristics
This section describes the DC electrical characteristics for the MPC826xA. Table 1 shows the maximum
electrical ratings.
Table 1. Absolute Maximum Ratings¹
Rating
Symbol
Value
Unit
Core supply voltage²
PLL supply voltage²
I/O supply voltage³
Input voltage⁴
VDD
–0.3 – 2.5
V
VCCSYN
–0.3 – 2.5
V
VDDH
–0.3 – 4.0
V
VIN
GND(–0.3) – 3.6
V
Junction temperature
T_j
120
°C
Storage temperature range
T_STG
(–55) – (+150)
°C
1 _{Absolute maximum ratings are stress ratings only; functional operation (see Table 2) at the maximums is not}
guaranteed. Stress beyond those listed may affect device reliability or cause permanent damage.
2 _{Caution: VDD/VCCSYN must not exceed VDDH by more than 0.4 V at any time, including during power-on reset.}
3 _{Caution: VDDH can exceed VDD/VCCSYN by 3.3 V during power on reset by no more than 100 mSec. VDDH should}
not exceed VDD/VCCSYN by more than 2.5 V during normal operation.
4 _{Caution: VIN must not exceed VDDH by more than 2.5 V at any time, including during power-on reset.}
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
Freescale Semiconductor
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