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MC9S08AC16_0911 Datasheet, PDF (6/336 Pages) Freescale Semiconductor, Inc – HCS08 Microcontrollers
Revision History
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The following revision history table summarizes changes contained in this document. For your
convenience, the page number designators have been linked to the appropriate location.
Revision
Number
0
1
2
3
4
5
6
7
8
Revision
Date
12/2007
12/2007
2/2008
3/2008
5/2008
6/2008
7/2008
5/2009
11/20/2009
Description of Changes
Initial Release.
Updated the package designators for the 32 LQFP and 44 LQFP to be LC and LD
respectively.
Corrected the SPI block module to be V3.
AC market launch.Verified that the ADC Temp Sensor values were correct.
Incorporated general release edits and updates, revised the Stop2 and Stop3 max
values, added the RoHS logo, and updated the back cover addresses.
Corrected the note in the TPM introduction.
Changed all instances of S9S08AWxxA to MC9S08AWxxA except in Appendix B.
Added 42SDIP package option.
Corrected SPI registers in Table 4-2. Added VBG in Table A-6.
Corrected title of Table 6-3, Figure 6-13, Figure 6-14, Table 6-5 and Figure 6-19.
Added errata for the following sections:
• Throughout (remove stop1 instances)
• Table 4-1
• Table 4-2
• Section 9.2, “Keyboard Pin Sharing”
• Section 9.3, “Features
• Table A-6
• Table A-7
• Figure A-12
Updated the whole document for MC9S08AW16A/MC9S08AW8A to support the third TPM
module.
Updated the TPM 1 channel to 4 for the 32-pin packages in the Table 1-1.
Updated the bit 2 of IRQSC register in the Table 4-2.
Updated the Temp Sensor Voltage in the Table A-9.
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© Freescale Semiconductor, Inc., 2007-2009. All rights reserved.
MC9S08AC16 Series Data Sheet, Rev. 8
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