33888 Datasheet, PDF (36/40 Pages) Freescale Semiconductor, Inc – Quad High-Side and Octal Low-Side Switch for Automotive

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
33888 Pin Connections
36-Pin PQFN
0.8 mm Pitch
12.0 mm x 12.0 mm Body
Figure 15. Thermal Test Board
Device on Thermal Test Board
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area A:
Cu heat-spreading areas on board
surface
Ambient Conditions: Natural convection, still air
Table 17. Thermal Resistance Performance
Thermal
Resistance
Ρ_θJAmn
Area A
(mm²)
0
300
1 = Power Chip, 2 = Logic Chip (°C/W)
m = 1,
n=1
37
m = 1, n = 2
m = 2, n = 1
36
m = 2,
n=2
37
29
29
30
600
28
27
29
Ρθ_JA is the thermal resistance between die junction and
ambient air.
This device is a dual die package. Index m indicates the
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
33888
36
Analog Integrated Circuit Device Data
Freescale Semiconductor