W77E532 Datasheet, PDF (78/86 Pages) Winbond – 8 BIT MICROCONTROLLER

W77E532/W77E532A
20. PACKAGE DIMENSIONS
20.1 40-pin DIP
40
E1
1
S
A A2
L
D
B
e1
B1
21
20
E
A1
Base Plane
Seating Plane
a
eA
Dimension in inches
Dimension in mm
Symbol
Min. Nom. Max. Min. Nom. Max.
A
A1
A2
B
0.010
0.150
0.016
0.155
0.018
0.210
0.160
0.022
0.254
3.81
0.406
5.334
3.937 4.064
0.457 0.559
B1
0.048 0.050 0.054 1.219 1.27 1.372
c
0.008 0.010 0.014 0.203 0.254 0.356
D
2.055 2.070
52.20 52.58
E
0.590 0.600 0.610 14.986 15.24 15.494
E1
0.540 0.545 0.550 13.72 13.84 13.97
e1
0.090 0.100 0.110 2.286 2.54 2.794
L
0.120 0.130 0.140 3.048 3.302 3.556
a
0
15
0
15
eA
0.630 0.650 0.670 16.00 16.51 17.01
S
0.090
2.286
Notes:
1. Dimension D Max. & S include mold flash or
c
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimension D & E1 include mold mismatch and
are determined at the mo.ld parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
20.2 44-pin PLCC
6
7
HD
D
1 44
40
39
E
HE
17
18
29
28
L
θ
Seating Plane
e
b
b1
GD
A2 _A
A1
y
GE
c
Symbol
A
A1
A2
b1
b
c
D
E
e
GD
GE
HD
HE
L
y
Dimension in inches
Dimension in mm
Min. Nom. Max. Min. Nom. Max.
0.185
4.699
0.020
0.508
0.145 0.150 0.155 3.683 3.81 3.937
0.026 0.028 0.032 0.66 0.711 0.813
0.016 0.018 0.022 0.406 0.457 0.559
0.008 0.010 0.014 0.203 0.254 0.356
0.648 0.653 0.658 16.46 16.59 16.71
0.648 0.653 0.658 16.46 16.59 16.71
0.050 BSC
1.27 BSC
0.590 0.610 0.630 14.99 15.49 16.00
0.590 0.610 0.630 14.99 15.49 16.00
0.680 0.690 0.700 17.27 17.53 17.78
0.680 0.690 0.700 17.27 17.53 17.78
0.090 0.100 0.110 2.296 2.54 2.794
0.004
0.10
Notes:
1. Dimension D & E do not include interlead
flash.
2. Dimension b1 does not include dambar
protrusion/intrusion.
3. Controlling dimension: Inches
4. General appearance spec. should be based
on final visual inspection spec.
- 78 -
Publication Release Date: June 30, 2009
Revision A10