KX022-1020 Datasheet, PDF (1/75 Pages) List of Unclassifed Manufacturers – Accelerometer Specifications

± 2g / 4g / 8g Tri-axis Digital
Accelerometer Specifications
PART NUMBER:
KX022-1020
Rev. 11.0
10-Sep-15
Product Description
The KX022 is a tri-axis ±2g, ±4g or ±8g silicon micromachined
accelerometer with integrated 256 byte buffer, orientation, tap/double tap,
and activity detecting algorithms. The sense element is fabricated using
Kionix’s proprietary plasma micromachining process technology.
Acceleration sensing is based on the principle of a differential capacitance
arising from acceleration-induced motion of the sense element, which
further utilizes common mode cancellation to decrease errors from process
variation, temperature, and environmental stress. The sense element is
hermetically sealed at the wafer level by bonding a second silicon lid wafer
to the device using a glass frit. A separate ASIC device packaged with the
sense element provides signal conditioning, and intelligent user-
programmable application algorithms. The accelerometer is delivered in a
2 x 2 x 0.9 mm LGA plastic package operating from a 1.8 – 3.6V DC
supply. Voltage regulators are used to maintain constant internal operating
voltages over the range of input supply voltages. This results in stable
operating characteristics over the range of input supply voltages and virtually undetectable ratiometric
error. I²C or SPI digital protocol is used to communicate with the chip to configure and check for
updates to the orientation, Directional Tap^TM detection and activity monitoring algorithms.
Features
 2 x 2 x 0.9 mm LGA
 User-selectable g Range and Output Data Rate
 User-selectable low power or high resolution mode
 Digital High-Pass Filter Outputs
 Embedded FIFO/FILO buffer
 Low Power Consumption with FlexSet™ Performance Optimization
 Internal voltage regulator
 Enhanced integrated Directional Tap/Double-Tap^TM, and Device-orientation Algorithms
 User-configurable wake-up function
 Digital I²C up to 3.4MHz
 Digital SPI up to 10MHz
 Lead-free Solderability
 Excellent Temperature Performance
 High Shock Survivability
 Factory Programmed Offset and Sensitivity
 Self-test Function
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